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Category:Albums produced by Tony ViscontiThe present invention relates to a programmable controller, in particular to a programmable controller comprising a central processing unit and input/output modules connected to the central processing unit via a bus, the central processing unit being linked to the input/output modules via a bus by means of one-wire slave-free modules connected to the central processing unit via a bus. The present invention further relates to a method of interfacing a programmable controller with input/output modules.
Programmable controllers are increasingly used in a wide range of applications such as, for example, industrial automation, process control and office automation. This creates a demand for programmable controllers which are better adapted to the requirements in a given application.
In particular, industrial applications use programmable controllers for controlling different kinds of input/output modules for making measurements and for controlling motor-operated devices. In this case, use is generally made of input/output modules with one or more input channels and one or more output channels, said input/output channels being connected to the programmable controller. To this end, a so-called I/O bus is typically provided between the programmable controller and the input/output modules, said I/O bus serving to link the different input/output channels to the programmable controller. The interface with the different input/output channels is provided by input modules which are connected to the I/O bus and by output modules which are connected to the I/O bus and which are controlled by the programmable controller.
From U.S. Pat. No. 5,974,077, a programmable controller comprising a CPU, a bus, a first group of input modules and a second group of output modules is known.
The object of the invention is to provide a programmable controller which is better adapted to the requirements in a given application. This object is achieved with a programmable controller according to the invention.
In a preferred embodiment, the input/output modules are connected to the CPU by means of one-wire slave-free modules. One-wire slave-free modules make it possible to avoid the need for any manual connection. In this case, the one-wire slave-free modules are linked to the CPU via a bus with suitable logic and/or control functions, said one-wire slave-free modules having a slave ( 01e38acffe
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Category:Musical groups from Los AngelesThe present invention relates to a method of etching a metal substrate used in a semiconductor device. More particularly, it relates to a method of etching a metal substrate used in a semiconductor device, wherein the structure of the metal substrate is controlled such that an etched portion in which the structure of the metal substrate is controlled is formed in a desired position.
When forming a circuit pattern on a substrate (for example, a semiconductor substrate) by photolithography, the exposure of the circuit pattern is performed by using a photoresist layer that is formed on the substrate. After the exposure, a developing process is performed on the substrate, whereby the circuit pattern is formed on the substrate. During the developing process, the photoresist layer, which is exposed to light, is removed and the circuit pattern is formed on the substrate.
A damascene method is adopted as one method for forming a circuit pattern on the substrate. In the damascene method, after a groove is formed on the substrate, an insulating layer is formed on the substrate having the groove, and after the insulating layer is filled in the groove, the surface of the substrate is planarized by chemical mechanical polishing (CMP). The damascene method does not require the photolithography process, which is essential in the conventional method of forming a circuit pattern. Thus, it is possible to reduce the number of the manufacturing steps, and it is possible to reduce the cost of the manufacturing process.
In the above-mentioned damascene method, the circuit pattern is formed by etching the metal substrate (including a conductive layer made of metal, an alloy of metal, or a conductive polymer) by using a mask pattern and an etching solution. In order to form a circuit pattern by etching the metal substrate, it is necessary to improve the etching selectivity of the metal substrate with respect to the mask pattern and the etching solution.
In a conventional method of etching the metal substrate, a mask pattern and an etching solution are employed to etch the metal substrate. When the circuit pattern is formed by etching the metal substrate, a portion of the metal substrate where the circuit pattern is not formed remains. In other words, when a damascene structure is formed, the remaining portion of the metal substrate hinders the formation of the
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